Die Attach Process Development, Senior Engineer
Onsemi Vietnam
Date: 2 weeks ago
City: Lapu-Lapu City
Contract type: Full time
Job Description
Major Duties and Responsibilities:
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Job Info
Major Duties and Responsibilities:
- Responsible for introducing new products from characterization, validation, large scale, qualification, and safe launch for mass production releases in dicing, die attach (solder paste, epoxy, DAF), clip attach, reflow, defluxing or sintering processes.
- Performs package design review, and risk analysis and conducts studies on materials suitable for the package & process
- Review engineering builds requirements and engineering instructions for new products
- Responsible for reviewing, generating, updating, and approving specifications
- Achieves operational objectives by contributing information and recommendations on new product releases
- Preparing and completing assembly build qualification reports, production release documents per device and systems configurations, safe launch reports for initial production released parts
- Education
- Degree of Materials, Mechanical, Electrical, Electronics, Chemical Engineering and/or BS Physics
- Experience
- More than five (5) years experience in New Product Introduction and/or Process Engineering in semiconductor assembly processes (die attach, clip attach, reflow, defluxing) for leadframe substrates (QFN, SOIC, TSSOP, and others)
- Experience in GaN (dicing/DA) and/or sintering processes is an advantage
- Skills:
- Strong skills in DOE (Design of Experiments), 7QC Tools, Data Analysis, Control Plan / FMEA, 8D and Problem Solving, Decision Analysis, Rheology, and material science
- Strong English communication skills
- Good interpersonal skills in collaborating with support groups
- Highly motivated to work in a dynamic environment, with good integrity and character
- Ability to multi-task and organize work systematically in meeting deadlines without compromising quality
onsemi (Nasdaq: ON) is driving disruptive innovations to help build a better future. With a focus on automotive and industrial end-markets, the company is accelerating change in megatrends such as vehicle electrification and safety, sustainable energy grids, industrial automation, and 5G and cloud infrastructure. With a highly differentiated and innovative product portfolio, onsemi creates intelligent power and sensing technologies that solve the world’s most complex challenges and leads the way in creating a safer, cleaner, and smarter world.
More details about our company benefits can be found here:
https://www.onsemi.com/careers/career-benefits
About The Team
We are committed to sourcing, attracting, and hiring high-performance innovators, while providing all candidates a positive recruitment experience that builds our brand as a great place to work.
Job Info
- Job Identification 2501617
- Job Category Engineering
- Posting Date 07/19/2024, 07:24 PM
- Degree Level Bachelors
- Job Schedule Full time
- Job Shift Day
- Locations 2nd Street, Block-C3, Lapu-Lapu City, 6015, PH
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