Interface Solution Engineer

Teradyne


Date: 4 days ago
City: Lapu-Lapu City
Contract type: Full time
Job Description

  • Provide global semiconductor interface test hardware solutions of next generation semiconductor devices for world-wide customers.
  • Provide chip test interface HW solution engineering to compare pros and cons of different approaches and recommend best option to customers considering both performance, lead time, cost.
  • Responsible for Testing circuits Design and super high layers PCB design for high complexity ATE device interface board correspond to various device testing, eg. Mobile application processor, High performance computer, AI, RF etc.
  • Responsible for scheme selection of a SUBSTRATE/MLO design in wafer testing, research for low Cost of Test scheme (considering TDE, Skip DIE, substrate stack-up)
  • Responsible for power integrity (PI) and signal integrity (SI) simulation at board level or system level, frequency domain or time domain to ensure HW product performance at design stage.
  • Implement complex mechanical design/simulation, cable design, thermal evaluation by collaborating with PCB design to achieve premium quality in hardware solution according to customer device testing ultimate challenges.
  • Responsible for global end to end hardware project management to ensure best quality and on time delivery.
  • Work closely with Teradyne Global supply chain, provide solutions to solve manufacture (DFM), assembly (DFA) challenges, ensure hardware products on time delivery and very high first pass rate.
  • New technology research, new products, new materials evaluation for next generation device testing
  • Deliver hardware design training and seminars to customers.

Qualifications

Engineering degree or masters (Electronics & Communication, Microelectronics, Mechatronics)

  • Fresh graduates with high scholastics record or high achievers are encouraged to apply
  • Graduate with a BS in Electronics, Computer, Electrical, and Mechatronics Engineering
  • Extensive experience in Cadence PCB Design tools
  • Good or sufficient knowledge on foundational electronics, theory and principle of application
  • Knowledge on Signal Integrity or Power Integrity is a valuable advantage
  • Knowledge on board and PCB design is an added advantage
  • Good English communications skill, both oral and written
  • Has great attention to details and has problem-solving skills
  • Possesses positive innate characteristics such as initiative and proactiveness
  • Appetite for continuous learning and passionate to learn and develop new skills
  • A solid foundation in electronic circuit design and analysis
  • Knowledgeable with PCB manufacturing processes, high-speed signal integrity design rules, and power distribution
  • Team player able to work in a cross-functional environment and ability to teach others of standard processes and methodologies.

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